Qualcomm today announced the full details of the new mobile device Snapdragon 845, which will feature the Kryo 385 CPU, a major development of the platform and the Adreno 630 graphics processor. , Which provides 30 percent faster performance for graphics.
According to Qualcomm, the platform will achieve 30 percent more energy efficiency than the previous Snapdragon 835 platform, which has proven efficient in battery life. The design of the new Kryo 385 is based on an ARM core and built on the second generation of manufacturing technology 10 nm enhanced Samsung.
Each kernel has its own L2 cache, along with a L3 cache with 2 MB of memory, and offers high performance nano-performance of 25 to 30 percent higher than the high-performance nuclei found in the Snapdragon 835 chip, while Low-performance nuclei provide 15 percent faster speeds than their previous processor counterparts.
The new chip is 30 percent faster in graphics processing and reduces energy consumption by 30 percent compared to the Snapdragon 835
The high-performance nuclei reach 2.8 GHz, while the low-performance nuclei reach 1.8 GHz. The chip includes a new version of the Spectra 280 signal processor, providing greater capacity for the Hexagon DSP digital signal processor, allowing for stronger performance Automated learning and applications of artificial intelligence.
The new processor supports up to 16 megapixels or a single 32 megapixel camera, and the new image signal processor allows capturing HDR videos with 4K resolution at 60 frames per second. It also supports capturing slow motion videos at 480 frames per second (720p) With HDR technology, and capture selective motion videos, with support for various depth sensor techniques.
The Snapdragon 845 processor has a dedicated secure processing unit within it, and the new chip can perform dynamic or basic authentication without running the code on the primary processor, making authentication data very difficult to penetrate. It also features a new X20 LTE modem that allows speeds of up to 1.2 Gb Second, representing an improvement of 20 percent compared to the X16 modem located in the Snapdragon 835 processor.
The new modem also supports the X20 dual LTE connection, which means that the phone will not have to keep a single chip on a 3G or 2G network, which may mean a lot to users of phones that have two pieces of communication, and the performance of Wi-Fi networks has been improved, The initial setup of 802.11ac connectivity will achieve improvements in connection speed up to 16 times higher and 30 percent greater efficiency.
The Bluetooth technology has been upgraded in terms of multicast capability, allowing the smart phone to be transmitted to multiple Bluetooth devices at the same time, bringing great implications for the wireless earphones, as the current wireless speakers force one of the speakers to act as a receiver and a transmitter while being sent Audio signal to the second speaker, the new capability allows the termination of the need for any transfer, which improves reception performance.
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